Xiaomi Unveils Xring O3 Chip Built by TSMC as It Takes on Huawei in Foldable Phones

TLDR

• Xiaomi launched the Xring O3, its second in-house smartphone processor, built on TSMC’s 3nm technology
• The chip is expected to power Xiaomi’s upcoming flagship foldable phone, with 200,000 to 300,000 units targeted
• TSMC is also making two other Xiaomi chips: the Xring O100 for AI and the Xring D100 for autonomous driving
• Global smartphone shipments are forecast to fall 14% in 2026, squeezing demand across the industry
• Xiaomi sold 65 million phones in the first half of 2026, down from 84 million in the same period of 2025

Xiaomi unveiled its new Xring O3 smartphone chip on Monday, with Taiwan Semiconductor Manufacturing Company set to produce it using 3-nanometre technology. The move marks the Chinese phone maker’s second in-house processor after the Xring O1 launched in May 2025.

$XIACF $TSM Xiaomi has unveiled its new Xring O3 smartphone chip, reportedly built by TSMC on its advanced 3nm process📱

The chip is expected to power Xiaomi’s next flagship foldable, with 200K–300K units targeted — reducing its reliance on Qualcomm and MediaTek. pic.twitter.com/UIe3BUYDc2

… Continue reading the full article at the original source below.